Filled vias are solid metal connections through advanced substrates like ceramic or glass—ideal for high-power, high-frequency, or mission-critical designs. Plated vias, with metal-lined walls, are simpler and cheaper but offer less conductivity and thermal performance. Choosing between them isn’t just technical—it’s strategic. Like a strong foundation, filled vias offer depth and reliability when your design truly demands it.

At GHz speeds, even the cleanest schematic can fall apart if the layout isn’t field-aware. In thin-film circuits, every trace radiates, every gap couples, and parasitic effects can quietly sabotage performance. This guide breaks down what causes crosstalk and parasitics, why thin-film designs are especially vulnerable, and five proven strategies to stop them—before they cost you compliance, yield, or time.

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